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Forum Teratec 2021
Roundtable
Tuesday June 22, 2021 from 11:00 a.m. to 12:00 p.m.

How the rise of Artificial intelligence is changing supplier offerings

He rise in power of tools using Artificial Intelligence and their growing diffusion lead to the upcoming of new hardware and software technologies, to process ever larger volumes of data faster and more efficiently.

This roundtable was held on Tuesday, June 22, 2021 from 11:00-am to 12:00-pm in remote. Moderated by journalist Jean-François Prevéraud, it has given the floor to representatives of Platinum Sponsors of the Teratec 2021 Forum..

With the participation of :

PLATINUM SPONSORS
Jean-Pierre Panziera
Chief Technology Director for Extreme Computing
Atos
Laurent Thiers
Vice President MEA
DDN Storage
Gautier Soubrane
Territory Manager for Western Europe and Head of EMEA Channel Sales
Graphcore
Jérémy Foulon
Responsable des solutions d'infrastructures HPC, HPE France
HPE
Jean-Laurent Philippe
Directeur des Ventes HPC EMEA
Intel
Lionel Meoni
Senior Pre-Sales Engineer
VAST Data

 

 

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For further information about the plenary sessions, please contact:

Jean-Pascal JEGU
Tél : +33 (0)9 70 65 02 10 - Mob.: +33 (0)6 11 44 49 59
jean-pascal.jegu@teratec.fr
Campus TERATEC
2, rue de la Piquetterie
91680 BRUYERES-LE-CHATEL
France

 

 

Back to the 2019 Teratec Forum Plenary sessions

Simulation and Big Data : technological challenges and diversity of uses

Discover through the plenary sessions of the Teratec Forum the new challenges and diversity of uses that digital technologies related to simulation and Big Data are for your companies.

Large industrial users have testified to the issues of the high-performance simulation in their company and provided their analysis on the strategies to imple-ment to master it well. Innovative technology providers and start-up presented their latest achievements and showed that these technologies, even the most advanced ones, are accessible to Small and Medium Enterprises.

Read the Proceedings of the Plenary Sessions of the Teratec 2019 Forum

With the participation of :

 
     
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